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Power MOSFET Reliability Summary
| Part Number Type | Die Type | Package | |||
|---|---|---|---|---|---|
| IRF830 | 17415 | TO-220 | |||
| Test 1097 | |||||
| Stress | Conditions | Results | Sample Size |
Duration | |
| Thermal Fatigue | PD=4.75W, delta Tj=125C | 0 | 40 | 10,000 | Cyc |
| Drain Bias | Tc=150C, Vds=80% Rated | 0 | 40 | 1000 | Hrs |
| Gate Bias | Tc=150C, Vgs=100% Rated | 0 | 40 | 1000 | Hrs |
| Temp Cycle | -65C, +150C, Air | 0 | 40 | 1000 | Cyc |
| Thermal Shock | -65C, +150C, Liquid | 0 | 40 | 1000 | Cyc |
| Operating LIfe | Tc=150C, Vds=15V | 0 | 40 | 1000 | Hrs |
| Pressure Cooker | Ta=121C, 15psi | 0 | 40 | 96 | Hrs |
| Part Number Type | Die Type | Package | |||
|---|---|---|---|---|---|
| IRF830 | 17415 | TO-220 | |||
| Test 2052 | |||||
| Stress | Conditions | Results | Sample Size |
Duration | |
| Thermal Fatigue | PD=4.75W, delta Tj=125C | 0 | 20 | 20,000 | Cyc |
| Drain Bias | Tc=150C, Vds=80% Rated | 0 | 20 | 1000 | Hrs |
| Gate Bias | Tc=150C, Vgs=100% Rated | 0 | 20 | 168 | Hrs |
| Temp Cycle | -65C, +150C, Air | 0 | 20 | 1000 | Cyc |
| Thermal Shock | -65C, +150C, Liquid | 0 | 20 | 1000 | Cyc |
| Operating LIfe | Tc=150C, Vds=15V | 0 | 20 | 2000 | Hrs |
| Pressure Cooker | Ta=121C, 15psi | 0 | 20 | 96 | Hrs |
