2005 Product Change Notification (PCN)

Existing products which is using Ablebond 8006 will be affected by the change. Fairchild Semiconductor is qualifying epoxy Ablebond 8006NS.

Shantou Huashan Electronic Devices CO. Ltd in China will be qualified as an alternative assembly and test site for Fairchild's Diode and Schottky diode devices packaged in the TO-220 package. Shantou Huashan Electronic Devices CO. Ltd. currently produces the TO-220 package for MOSFET, BJT and Regulator products and TO-126 package for Fairchild. Shantou Huashan Electronic Devices CO. Ltd. is ISO9002 certified. In addition toShantou Huashan Electronic Devices CO. Ltd. Fairchild will also continue to assemble and test TO-220 products using existing qualified suppliers such as ENOCH and SP in Korea.

All SPM products packaged with SPM32-AA will be transfer from Fairchild Semiconductor Corporation's manufacturing facility in Bucheon, Korea to Fairchild Semiconductor(Suzhou) Co., LTD (FSSZ). This new facility is located at 1 Sutong Road, China-Singapore Suzhou Industrial Park Suzhou, Jiangsu P. R. of China. There is no difference in process and material between the qualified sites and the new Fairchild assembly and test facility to be qualified. Package dimension will not be change FSSZ is already a qualified assembly and test sites for several other packages(TO-251, TO-252, TO-263, TO-220, SPM27-BA)

Fairchild Semiconductor is announcing an additional wafer fab location for the processing of FACT devices. These devices are currently manufactured in Fairchild's 6-inch wafer fab located in South Portland, ME. The additional manufacturing facility will be the CSMC 6-inch CS80C wafer fab located in Shanghai, China (PRC).

Fairchild Semiconductor is announcing an additional wafer fab location for the processing of FACT devices. These devices are currently manufactured in Fairchild's 6-inch wafer fab located in South Portland, ME. The additional manufacturing facility will be CSMC's 6-inch CS80C wafer fab located in Shanghai, China (PRC).

As part of Fairchild Semiconductor's on-going effort to increase its manufacturing capacity for primary Bipolar products in SOT23 package, we have qualified Fairchild Bucheon as alternate die source for SOT-23 products. This Fairchild Bucheon wafer fabrication site is located at 82-3 Dodang-dong, Wonmi-gu, Bucheon-si, Gyeonggi-do, Korea. This is intended to meet additional demand for these selected Bipolar products in SOT23 package by having additional flexibility in die source. The following are the wafer fab process and assembly process comparison between the existing Torex fabrication site and Fairchild Bucheon die fabrication site to be qualified.

Fairchild Semiconductor DO-35 package is currently assembled and tested in one of its subcontracting plants, Tak Cheong Electronics, located in Shanwei, Guangdong, China. As part of Fairchild Semiconductor's on-going efforts to develop cost effective products, we are already in the Phase 2 in the qualification of this new DO-35 package dimension. This is already implemented in all switching diode parts built in DO-35 package using the D3D die. Expected changes are as follows:

As part of Fairchild Semiconductor on going effort to increase its manufacturing capacity for various products in our SO-8 FLMP package, we have qualified an in house process using lead free bumps to replace the high lead process. In addition, we are adding a suffix of "_F077" to the part name that will designate this change in the product. These products will also be marked with an identifier of a vertical line. See below for example.

20SSOP will transfer package assembly and test site from STS in Korea to PSTS in China. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China is same company with STS. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China will be qualified as an alternative assembly and test site for Fairchild's devices packaged in the 20SSOP package. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China currently produces 20SSOP package for another customer. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China is ISO9001, QS-9000 and ISO14001 certificated.

The change involves the conversion of package surface finish from polished to matte.

10SSOP will transfer package assembly and test site from STS in Korea to PSTS in China. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China is same company with STS. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China will be qualified as an alternative assembly and test site for Fairchild's devices packaged in the 10SSOP package. PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China currently produces 10SSOP package for another customer.PSTS (Phoenix Semiconductor Telecommunication (suzhou) CO., LTD) in China is ISO9001, QS-9000 and ISO14001 certificated.

As part of Fairchild Semiconductor ongoing effort to increase its manufacturing capacity for various products in our SO-8 Wireless packages, we intend to replace an outside foundry high lead process with an internal lead free bumping process. This assembly site has TS16949 certification.

The value of I_BPK changed from 0.6A/1.0A/1.4A to 0.8A/1.2A/1.6A. Note 4 is deleted. "4. These parameters, although not guaranteed at the design, are not tested in mass production." The modification has been made to reassure the quality of our product to the customers. With the previous spec, the current limit in burst mode was only guaranteed by design and not tested in the final test. Recently we decided to test this spec in the final test and the data are changed slightly based on the real measured data. The revision has been made and note 4 was removed to ensure that our specs are test proven.

Fairchild is announcing the qualification of the following assembly site to augment the production of the affected devices due to the increased demand. This added capacity will allow Fairchild to operate more efficiently and better serve our customers. Amkor Technology

Fairchild Semiconductor (Suzhou) Co., LTD will be qualified as an additional assembly and test site as part of Fairchild Semiconductor's ongoing effort to increase manufacturing capacity for our various products assembled in the TO-263(D2pak) package. Also, this site is TS-16949 certified. This facility is located at 1 Sutong Road, China-Singapore Suzhou Industrial Park Suzhou, Jiangsu P. R. of China.

As part of Fairchild Semiconductor's effort to increase capacity of our various products in SOT23 package and to improve customer service, Fairchild Semiconductor Cebu, Philippines (FSCP) facility will be qualified as an alternative assembly and test site for certain products in the SOT23 package as defined in the "Affected FSIDs" section. This change is intended to meet additional demand for various products in SOT23 package, improve cycle time and to improve our service to our customers. The following are the direct material, package dimensions, marking spec and packaging spec comparisons between FSBK managed assembly site and FSCP assembly site.

The PCB and CAP will have a notch added so they match better in the assembly process. Refer to the below pictures for details.

Current 1.5mil and 2.0mil Gold wire will be replaced by same diameter of Copper wire for the products which are listed in "Affected FSID"

The above mentioned Products is manufactured another FAB location including in Fairchild Korea. The another FAB Location is "JILIN MAGIC SEMICONDUCTOR Co. Ltd", China. The Products manufactured at JILIN is used same pattern, process and package as Fairchild.

Fairchild is announcing the qualification of the following assembly sites to augment the production of the affected devices due to the increased demand. This added capacity will allow Fairchild to operate more efficiently and better serve our customers. Package Lead count Additional Assembly Sites Micropak 6 Hana (BT), Fairchild Malaysia (BT) Micropak 8 Hana (BT), Fairchild Malaysia (BT) Micropak 10 Hana (BT), Fairchild Malaysia (BT) All final test will still be done in Fairchild Penang, Malaysia. All parts assembled in the various sites are completely interchangeable. This is intended to be a broad notification of a large project consisting of individual reliability tests that will cover each package and assembly location. This forecast will serve as the FCN for final PCN to follow.

These devices are currently manufactured in Fairchild's qualified subcontractors with non Pb-free plating. Fairchild is qualifying these devices in Pb-free plating with some changes in bill of materials. These changes are being implemented to supply the devices with Pb-free plating by maintaining its existing MSL level at leadfree reflow peak temperature. These products will meet Fairchild's published data book specifications.

The FAN5232/33 products are currently being assembled in a 5lds SOT23 package at NSEB facility in Bangkok, Thailand. As part of Fairchild Semiconductor's on-going effort to increase its manufacturing capacity for various products, we intend to qualify Fairchild assembly facility at Cebu, Philippines as an additional/alternate site for these SOT23 products. The Cebu site is ISO-9002 certified and qualified for other Fairchild Semiconductor products, specifically in the SOT23 package. The qualification is intended to meet additional demand for various products in SOT23 package by having additional flexibility in manufacturing locations.

There will be no impact to the functionality or electrical characteristics of this device. This product will continue to be fully complaint to all published databook specifications. Quality and Reliability will remain at the highest standards already with Fairchild's existing products.

Describe present process / product: Original Vf binning requirement for QTLP670CIW_7837D is tested as per below.

As part of Fairchild Semiconductor's ongoing efforts to improve manufacturing flexibility, Fairchild's wafer fab facility in Singapore, will be qualified as an alternate wafer fab location. These chips will be interchangeable with the existing chip from the current fab location.

Wooseok S. Tech (Weihai) CO., LTD in China will be qualified as an alternative assembly and test site for Fairchild's devices packaged in the TO-126 package. Wooseok S. Tech (Weihai) CO., LTD in China currently produces TO-92 and TO-92S packages for Fairchild. The Wooseok S. Tech (Weihai) CO., LTD is TS16949 and ISO14001 certified.

As part of Fairchild Semiconductor's effort to enhance quality and traceability of packaged materials, we are implementing a datecode on our SOD123 marking. Change From: 1.0 Device Mark

This is a revision to Information Only Notification 20044702 that was issued as an update to PCN 20040403-A, a change to copper bonding wire for Discrete products in the SO-8 package. The previous notification indicated that special flow codes were established to specifically order parts with copper wire. That was our first phase implementation where we were transitioning from Au wire to Cu wire. That transition phase is now complete .We will now remove the flow code and convert the standard part to Cu wire. Products will be shipped for an interim period of time with Au wire until the inventory is depleted and then converted fully to Cu wire.

Shantou Huashan Electronic Devices CO. Ltd in China will be qualified as an alternative assembly and test site for Fairchild's Diode and Schottky diode devices packaged in the TO-220 package. Shantou Huashan Electronic Devices CO. Ltd. currently produces the TO-220 package for MOSFET, BJT and Regulator products and TO-126 package for Fairchild. Shantou Huashan Electronic Devices CO. Ltd. is ISO9002 certified. In addition toShantou Huashan Electronic Devices CO. Ltd. Fairchild will also continue to assemble and test TO-220 products using existing qualified suppliers such as ENOCH and SP in Korea,

In order to further enhance the Emitter to Base junction breakdown voltage, a non-conductive epoxy die attach material will be used for the detector chip. The die attach material for the LED will remain unchanged.

Fairchild is migrating the 4-pin dual in-line package optocoupler from the coplanar construction to an over-under package construction.

As part of Fairchild Semiconductor's effort to increase and secure a future available capacity and meet customer's need of a reliable alternate source for General Purpose Rectifiers(GPRs) in SMA, SMB and SMC packages, qualification of Taiwan Semiconductor( TSC )located in China, has been undertaken. TSC has been qualified to do assembly, test and finish of these parts . This alternate sourcing is intended to meet additional demand for various GPRs devices in said packages, improve cycle time and service to customers. These products are currently assembled and tested in Panjit International Inc. with factories in Taiwan and China. A comparison of the differences between Panjit and TSC built parts are presented below:

As part of Fairchild Semiconductor ongoing effort to increase its manufacturing capacity for various products in our SO-8 Wireless packages, we intend to replace an outside foundry high lead process with an internal lead free bumping process. This assembly site has TS16949 certification.

Wooseok S. Tech Corporation and SHEDCL in China will be qualified as an alternative assembly and test site for Fairchild's Regulator devices packaged in the TO-220 package. Wooseok S. Tech currently produces TO-92 and TO-92S packages for Fairchild SHEDCL currently produces the TO-220 package for MOS & BJT products and TO-126 package for Fairchild. The Wooseok S.Tech Corporation is TS-16949 certified and SHEDCL is ISO9002 certified.

As part of Fairchild Semiconductor's on-going effort to increase its manufacturing capacity for various products in a SOT223 package, we intend to qualify Jiangsu Changjiang Electronics Technology Co.,LTD as an additional/alternate site for SOT223 products. In addition, this site is ISO-9002 certified and qualified for other Fairchild Semiconductor products, specifically in the SOT23 package. This new assembly/test facility is located at Binjiang Road, Jiangyin, Jiangsu, China. The qualification is intended to meet additional demand for various products in SOT223 package by having additional flexibility in manufacturing locations. The following are the package dimensional, process and material comparison between the Fairchild assembly and test site and the additional assembly and test facility to be qualified.

Fairchild Semiconductor West Jordan, UT is being qualified as an additional wafer fabrication site as part of Fairchild Semiconductor's ongoing effort to increase manufacturing capacity for our various products. The West Jordan facility is TS-16949 certified.

Original qualification of the 28-lead SSOP package was done at Moisture Sensitivity Level equal to 3, which requires dry packing of product in moisture barrier bags. The products in this package have been requalified to Moisture Sensitivity Level equal to 1, and no longer require dry packing. No changes are being made to the assembly process or package materials.

As part of continuous quality improvement initiative Fairchild will replace current AlGaAs with AsAlInGaP chip

As part of Fairchild Semiconductor's effort to increase and secure a future available capacity and come up with a reliable 2nd source, GEM Electronics Co. Ltd., located in Shanghai, China is hereby qualified as an additional assembly, test and finishing subcontractor for MosFet BGA Cu Bump package. This change is intended to meet additional demand for various products in this package, improve cycle time and service to customers. These products are currently assembled and tested in Fairchild Semiconductor, Cebu, Philippines.

Per customer's request we have changed from a 2Ku reel to a 10Ku reel. Refer to the drawings here below for the reel dimensions. Reel size before change implementation, with 2ku/reel:

AUK(DALIAN) CO., LTD in China will be qualified as an alternative assembly and test site for Fairchild's devices packaged in the TO-92L package. AUK(DALIAN) CO., LTD in China currently produces TO-92 and TO-92S packages for Fairchild. The AUK(DALIAN) CO., LTD is ISO9001 and QS9000 certified.

As part of Fairchild Semiconductor's continuous effort to enhance traceability, package marking will be changed as belows, Year & Week Code will be added.

Fairchild Semiconductor (Suzhou) Co., LTD will be qualified as an additional assembly and test site as part of Fairchild Semiconductor's ongoing effort to increase manufacturing capacity for our various products assembled in the TO-263(D2pak) package. Also, this site is TS-16949 certified. This facility is located at 1 Sutong Road, China-Singapore Suzhou Industrial Park Suzhou, Jiangsu P. R. of China.

These devices are currently manufactured in Fairchild's qualified subcontractors with non Pb-free plating. Fairchild is qualifying these devices in Pb-free plating with some changes in bill of materials. These changes are being implemented to supply the devices with Pb-free plating by maintaining its existing MSL level at leadfree reflow peak temperature. These products will meet Fairchild's published data book specifications.

The 3M's part model #3000 is now accepted and considered an alternate carrier tape material for LL34 tape and reel process. This shall be used along with the existing carrier tape material also from 3M with part model #2703. Either part ( only one part model at a time ) can be used in a lot at any given time to serve specific customer orders.