December 2004 Product Change Notification (PCN)
| PCN# | PCN Date | Description of Change | Notification |
| 20044801 | 1/5/2005 | Packing Method | 20044801.rtf |
| 20045201 | 1/2/2005 | Packing Material Composition | 20045201.rtf |
| 20045103 | 12/30/2004 | Die Revision | 20045103.rtf |
| 20044902 | 12/30/2004 | Alternate Fab Location | 20044902.rtf |
| 20045104 | 12/29/2004 | Alternate Assembly/Test Location/Qualification | 20045104.rtf |
| 20045101 | 12/29/2004 | Databook Specifications | 20045101.rtf |
| 20045007 | 12/29/2004 | Junction Coating Formulation | 20045007.rtf |
| 20045005 | 12/20/2004 | Alternate Fab Location | 20045005.rtf |
| 20044802 | 12/15/2004 | Marking Method | 20044802.rtf |
| 20044704 | 12/13/2004 | Fab Process Change | 20044704.rtf |
| 20044702 | 12/9/2004 | Marking Method | 20044702.rtf |
| 20044506 | 12/6/2004 | Alternate Assembly Site Location/Qualification | 20044506.rtf |
| 20044701 | 12/6/04 | Marking Format or Content | 20044701.rtf |
| 20044705 | 12/5/2004 | New Assembly Site Location/Qualification | 20044705.rtf |
| 20043505-A | 12/1/2004 | Bond Wire Material Composition | 20043505-A.rtf |
Note: for more product change notification customer letters, please visit PCNalert.com (exiting Fairchild)
