February 2004 Product Change Notification (PCN)
| PCN# | PCN Date | Description of Change | Notification |
| 20040407 | 2/25/2004 | Die Attach Method | 20040407.pdf |
| 20034307-a | 2/24/2004 | Assembly Process | 20034307-a.pdf |
| 20040606 | 2/24/2004 | Die Shrink | 20040606.pdf |
| 20040302 | 2/23/2004 | Die Revision | 20040302.pdf |
| 20040605 | 2/23/2004 | Alternate Assembly/Test Location/Qualification | 20040605.pdf |
| 20040702 | 2/19/2004 | Information Only | 20040702.pdf |
| 20033708-b | 2/19/2004 | Alternate Fab Location | 20033708-b.pdf |
| 20040410 | 2/16/2004 | Packing Material Dimensions (Rails/ Boxes) | 20040410.pdf |
| 20040403 | 2/13/2004 | Bond Wire Material Composition | 20040403.pdf |
| 20040204 | 2/13/2004 | Alternate Assembly/Test Location/Qualification | 20040204.pdf |
| 20040409 | 2/9/2004 | Test Method | 20040409.pdf |
| 20035002 | 2/9/2004 | Plating Material Change | 20035002.pdf |
| 20040501 | 2/9/2004 | Alternate Assembly /Test Location/Qualification | 20040501.pdf |
| 20033803-b | 2/6/2004 | Alternate Fab Location | 20033803-b.pdf |
| 20040414 | 2/5/2004 | Test Method | 20040414.pdf |
| 20040205-a | 2/4/2004 | Alternate Fab Location | 20040205-a.pdf |
| 20040303 | 2/3/2004 | Alternative Assembly/Test Location/Qualification | 20040303.pdf |
| 20040406 | 2/2/2004 | Metallization Mask Revision | 20040406.pdf |
| 20040405 | 2/2/2004 | Die Shrink | 20040405.pdf |
| 20040001 | 2/2/2004 | Bump Process / Method | 20040001.pdf |
Note: for more product change notification customer letters, please visit PCNalert.com (exiting Fairchild)
