2008 Product Change Notification (PCN)

(From): Optoelectronics detector devices utilized in the assembly of the attached affected products are currently fabricated at China Resources (CRS) 4 inch fabrication facility located in Hong Kong, China. (To): Optoelectronics detector devices utilized in the assembly of the attached affected products will be fabricated at CRS 6 inch fabrication facility located in Wuxi, China. There will be no detector device, design, die size or die thickness changes for the affected FSID's. Product assembled with detector die manufactured at Wuxi facility will be fully compliant to all publish databook specifications and will be interchangeable with products manufactured at the existing wafer fab location. Quality and reliability will remain at the highest levels already demonstrated with Fairchild existing products.

(From): Current device Mark Line 2 is .32 (To): New device mark Mark Line 2 will be .2P

(From): Devices belong to Suzhou Non-JEDEC TO220 use tube A; Devices belong to Suzhou JEDEC TO220 use tube B (refer to below detail tube drawings). (To): Keep the Non-JEDEC tube A and modify the JEDEC tube B, to make it has the same design as Non-JEDEC tube (refer to below detail tube drawing).

(From): Plain Carrier Tape Type. Vendor is Reel Service Phils. (To): Corrugated Carrier Tape. Vendor is CPAK Malaysia.

(From): PDIP08 assembly at Subcon Hana Thailand. (To): New subcon AIC to take over PDIP08 assembly from Subcon Hana Thailand.

(From): Fairchild products currently manufactured using Fairchild's 6-inch class 1, Fab process in South Portland, ME. (To): Products will be manufactured using Fairchild's 8-inch class 1 Fab process in South Portland, ME. Die size, design, geometery, and layout of the affected products remains unchanged. Products manufactured on the 8-inch line will be fully compliant to all published datasheet specifications and will be completely interchangable with current product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): Paper box packing for GBPC(W) parts (To): Plastic tray + box + shrinkage film to pack the GBPC(W) parts

(From): Current top mark for SOIC 8L package assembly at FSC approved manufacturing location (Carsem) is using ink top mark. (To): To change the marking process for SOIC 8L package assembly at FSC approved manufacturing location (Carsem) to Laser top mark.

(From): Tianjin Everwell Technology,located in TianJin city,China
Description of Change (To): YangXingEverWell Electronics,located in YangXin city,China,is
being added as an alternative assembly/test location.There is no difference in package
dimension,process and material between the 2 sites

(From): Optoelectronics detector devices currently fabrication at China Resources (CRS). (To): Optoelectronics detector devices will be fabricated at an alternate source located in Taiwan. Product using die from the alternate source will be fully compliant to all published databook specifications and will be interchangeable with the existing die. Quality and reliability will remain at the highest level already demonstrated with Fairchild existing products.

(From): SOT-23F-3lead packages assemble with KCC non-green mold compound, KTMC1050TM as shown in Table 1. (To): SOT-23F-3lead packages assemble with KCC green mold compound, KTMC1050GR as shown in Table 2.

(From): SOT23 package assembly at UTL using non Green mold compound, Sumitomo EME-6710SJ. (To): SOT23 package assembly at UTL using Green mold compound, Sumitomo G600.

(From): 4um/40V fab process in Bucheon, Korea (To): 1.5um/40V fab process in Bucheon, Korea. Functionality and electrical characterics remain within current datasheet specifications.

Fairchild Semiconductor wishes to advise you that we intend to discontinue the product(s) listed below. Our records indicate that you have either purchased or submitted technical inquiries regarding one or more of the listed product(s). Fairchild will not accept orders for the listed products 6 month(s) from today.

(From): Wire changed for SO-8 package from Au wire. (To): Wire changed for SO-8 package to Cu wire.

(From): VSOP package assembly at all FSC approved manufacturing locations using non Green mold compound, Nitto MP-8000AN. (To): VSOP package assembly at all FSC approved manufacturing locations using Green mold compound, Sumitomo G600.

(From): Selected Tiny Logic 6-lead ULP/ULP-A devices manufactured on South Portlands FS35C Fab process line and assembled in MicroPak at Hana or ASEM. (To): The same design schematics are used but the die will be revised to add bond pad over active layer. For MicroPak package, Fairchild Malaysia (FSPM) will be added as an additional assembly location.

(From): Plant 1 in Bangna, being the current Assembly Location. (To): Plant 2 in Wellgrow, being the new Assembly Location. SOT package stopped assembly in Plant 1.

(From): Non-Green EMC name: KTMC1060SC(Vendor: KCC) (To): Green EMC name: KTMC1050GS(Vendor: KCC).

(From): a colon ( : ) should be indicated after the glass axial diodes general switching marking for Lead ( Pb ) Free device in the third line. (To): Cancel a colon ( : ) after the glass axial diodes general switching marking for Lead ( Pb ) Free device in the third line.

(From): TO92R package assembled in AUK-D using copper leadframe and Au wire as referenced in table 1. (To): TO92R package assembly at AUK-D will utilize Fe leadframe and Cu wire in addition to the current Copper leadframe and Au wire.(There is no difference in package dimension and electrical specification)

(From): TSC(TianJin) (To): TSC(YangXin) is being added as an alternative assembly/test location. There is no difference in package dimension, process and material between the two sites.

(From): Optoelectronics detector devices currently fabrication at China Resources (CRS). (To): Optotelectronics detector devices will also be fabricated at the Fairchild Semiconductor 6" fabrication facility located in South Portland, Maine. The South Portland die will be an alternate source to the detector die currently used in the effected FSID list. Product using die from the alternate source will be fully compliant to all published databook specifications and will be interchangeable with the existing product. Quality and reliability will remain at the highest level already demonstrated with Fairchild existing products.

(From): Single source of TO220F packing tube Shanghai Hwayeon Platic CO.,LTD. (To): Increase second source of TO220F packing tube Daegwang Plastic CO., LTD.

(From): The selected CSP (Chip Scale Product) is currently manufactured at Fairchild Semiconductor, located in South Portland, Maine. Current bump process is completed by Amkor Technology Inc., located in, North Carolina "6-inch flow." Current back-grind location is Fairchild Semiconductor in Salt Lake. Current Final Test location is Fairchild Semiconductor in Cebu, Philippines. (To): The selected CSP (Chip Scale Product) will be manufactured according to the following qualified flow: manufacturing will take place at Fairchild Semiconductor, South Portland, Maine. The bump process is being transferred to Amkor Technology, Inc, located in Korea "8-inch flow." New back-grind and final test location will be completed at Fairchild Semiconductor located in Penang, Malaysia.

(From): TO3PF 3 Leads product is currently manufactured at SP Semiconductor & Communication Co Ltd. located in Korea using materials referenced in table 1. (To): TO3PF 3 leads product will be manufactured at Fairchild Semiconductor located in Suzhou, China using materials referenced in table 1. Changes in soft solder die attach material, Leadframe base materials and lead finish plating bath have been made to align with standard materials and process currently utilized in FSC, Suzhou Manufaturing line. Package outline drawing of the affected products remains un-changed. Product will be fully compliant to all published data sheet specifications and will be interchangeable with current material. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): Package retract pin hole shape Retract pin D=1.4mm. (To): BUSH type for retract pin hole D(with bush)=2.0mm, D(pin)=1.0mm.

(From): SC70 package assembly in FSC approved manufacturing location (FSCP) using non Green mold compound as shown in table 1: (To): SC70 package assembly in FSC approved manufacturing location (FSCP) using Green mold compound as shown in table 2:

(From): StatsChipPAC (Kuala Lumpur, Malaysia) e (To): Fairchild Semiconductor (Suzhou, China)

(From): 1. D2PAK/I2PAK 2 and 3 Leads are currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. 2. Package outline did not confirm to JEDEC requirement. (To): 1. Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for D2PAK/I2PAK 2 and 3 leads. 2. New qualified package outline will confirm to JEDEC requirement.

(From): TO220 2 and 3 Leads are currently being manufactured at SPS (SP Semiconductor & communication Co Ltd)/ENOCH located in Korea. (To): Qualify Fairchild Semiconductor located in Suzhou, China as an additional Assembly and Test manufacturing site for TO220 2 and 3 leads.

(From): Lead frame vendor: Mitsui Hitec/Samsung Techwin/Poongsan Philippine. (To): Lead frame vendor: Mitsui Hitec/Samsung Techwin/Poongsan Philippine and Ningbo Kangqiang Electronics Co.,Ltd.(china)

(From): TO3P 3 Leads is currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. (To): 1. Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for TO3P 3 leads package, and comply with Suzhou current TO3PN 3 leads package. 2. Suzhou assembled TO3PN 3 leads package has one difference from the existing TO3P 3 leads package, but meet the EIAJ dimensional standards. (refer to below detail POD comparison)

(From): 1. TO220F 6 Leads are currently being manufactured at Fairchild Semiconductor Co Ltd. located at Cebu in Philippines. (To): 1. Qualify Fairchild Semiconductor Co Ltd. located in Suzhou as an alternate Assembly and Test manufacturing site for TO220F 6 leads. 2. There is no change in BOM 3. There is no change in package outline drawing 4. Product quality and reliability is not impacted.

This notification letter is to inform Fairchild Semiconductor Corporation's customers of our Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.

(From): Dpak with heatsink protrusion and Dpak with flat heatsink are not combined in one reel per lot. (To): Dpak with heatsink protrusion and Dpak with flat heatsink will be combined in one reel per lot. The heatsink dimensions are within marketing specs. Reason for Change :

(From): Electrical Characteristics (Ta = -40C to 85C) for If(off) Control Current for Off-State Resistance. (To): Electrical Characteristics (Ta = 25C) for If(off) Control Current for Off-State Resistance

(From): SSOT-3 and SSOT-6 package assembly in FSC approved manufacturing locations using non-Green mold compound as shown in table 1: (To): SSOT-3 and SSOT-6 package assembly at all FSC approved manufacturing locations using Green mold compound as shown in table 2:

(From): Current wafer and die sales Assembly Site: STATSChipPAC MALAYSIA SDN BHD (SCM) at 73, Lorong Enggang ulu Kelang FTZ, 54200 Kuala Lumpur, Malaysia. (To): New wafer and die sales Assembly Site: FAIRCHILD SEMICONDUCTOR (PHILIPPINES), INC. (FSCP) at MEPZ, Lapu-lapu City, Cebu Philippines 6015.

(From): Affected products assembled and tested in TO92 package at ASE (WeiHai) Company and AUK (DaLian) Company (To): Jiangsu Changjiang Electronics Technology (JCET) in China is being qualified as an additional TO92 package assembly/test site, Changes in package BOM are detailed in the following tables. Affected products will be fully compliant to the existing Fairchild Marketing outline drawing (MKT-ZA03D (TO92-3L straight lead) and MKT-TO92J61Z (TO92-3L Ammo style formed lead)) and all current published data sheet specifications. Product assembled at JCET will be interchangeable with current product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using non-Green mold compound as shown in table 1: (To): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using Green mold compound as shown in table 2:

(From): Aimhigh global corp. in Korea. (To): SP Semiconductor & Communication Co., Ltd. in Korea. It's also certified for TS16949 and ISO14001.

(From): Optoelectronics detector devices utilized in the assembly of the attached affected products are currently fabricated at China Resources (CRS) 4 inch fabrication facility located in Hong Kong, China. (To): Optoelectronics detector devices utilized in the assembly of the attached affected products will be fabricated at CRS 6 inch fabrication facility located in Wuxi, China. There will be no detector device, design, die size or die thickness changes for the affected FSID's. Product assembled with detector die manufactured at Wuxi facility will be fully compliant to all publish databook specifications and will be interchangeable with products manufactured at the existing wafer fab location. Quality and reliability will remain at the highest levels already demonstrated with Fairchild existing products.

(From): D/I PAK 2 and 3 Leads are currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. (To): Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for D/I PAK 2 and 3 leads. Reason for Change : 1. Qualification of new manufacturing site to improve capacity flexibility

(From): 8L MLP3x3 package assembly at all FSC approved manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1. (To): 8L MLP 3x3 package assembly at all FSC approved manufacturing location(s) (Carsem) using Green mold compound as shown in table 2.

(From): Wafer fabrication: FSME ( USA ) Wafer Bump: Amkor K4 (Korea) Backgrind: Amkor T3 ( Taiwan ) Die processing: Amkor T3 ( Taiwan ) or FSPM ( Malaysia) (To): Wafer fabrication: FSME ( USA ) Wafer Bump: Amkor K4 (Korea) Backgrind: Amkor T3 ( Taiwan ) or FSPM (Malaysia) Die processing: Amkor T3 ( Taiwan ) or FSPM ( Malaysia)

(From): Selected Tiny Logic 5-lead ULP/ULP-A devices manufactured on South Portland FS35C Fab process line and assembled in Micropak at Hana or ASEM and in SC-70 packages. (To): The same Design schematics are used but the die will be revised to add bond pad over active layer. For the Micropak package, Fairchild Malaysia (FSPM) will be added as an additional assembly location.

(From): Selected Mosfet products currently manufactured using the 8-inch line in Mountain Top, PA. The backmetal for the affected products is being changed from 5KA, 3KA, 3.5KA, 20KA (AL-Ti-Ni-Ag). (To): Selected Mosfet devices currently fabricated at Fairchild Semiconductor 8-inch line in Mountain Top, PA, USA will be also manufactured at Advanced Semiconductor Manufacturing Corporation (ASMC), the 6-inch facility for wafer fabrication located in Shanghai, China. The backmetal of these selected devices is being changed to 3KA, 2KA, 10KA (Ti-Ni-Ag). The new backmetal, Ti-Ni-Ag, is a standard backmetal system used on other qualified MOSFET products. There will be no additional change to the die layout, die size, geometry, substrate, assembly and packaging, product datasheet, performance and function of any affected devices. Quality and reliability will remain at highest standard.

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): Selected MLP 8x8 products currently manufactured at Polar Semiconductor using the 8-inch process. Polar Semiconductor is located at 2800 East Old Shakopee Rd., Bloomington, MN 55425. (To): Products will now be produced both at Polar Semiconductor as well as at Jazz Semiconductor using 8-inch process. Jazz Semiconductor is located at 4321 Jamboree Rd., Newport Beach, CA 92660 (ISO9001, ISO14001, and BS7799 certifications).

(From): Fairchild products currently manufactured using Fairchild's 6-inch class 1, fab process in South Portland, ME (To): Products will now be produced on both 6 inch and 8 inch wafer Diameters. Manufacturing will occur in the same 6-inch Class-1 fab currently producing these products. In some cases, new 8 inch equipment will be added to accommodate the 6 to 8 inch processing conversion. Die size, design, geometry, or layout of the affected products remains un-changed. 8 inch products will be fully compliant to all published data sheet specifications and will be completely interchangeable with current 6-inch product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.

(From): TO3P 3 Leads are currently being manufactured at SPS (SP Semiconductor & Communication Co Ltd) located in Korea. (To): 1. Qualify Fairchild Semiconductor located in Suzhou, China as a new Assembly and Test manufacturing site for TO3P 3 leads package, and comply with Suzhou current TO3PN 3 leads package. 2. Suzhou assembled TO3PN 3 leads package has one difference from the existing TO3P 3 leads package, but meet the EIAJ dimensional standards. (refer to below detail POD comparison)

(From): UVLO ( Vin rising ) 2.65 V min. UVLO ( Vin falling ) 2.35 V min. (To): UVLO ( Vin rising ) 2.60 V min. UVLO ( Vin falling ) 2.30 V min.

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): StatsChipPAC (Kuala Lumpur, Malaysia) (To): Fairchild Semiconductor (Suzhou, China)

(From): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using non-Green mold compound as shown in table 1: (To): SOIC-8 FLMP, SSOT-6 FLMP and SC75-6L FLMP package assembly in FSC approved manufacturing locations using Green mold compound as shown in table 2:

(From): Hysol Epoxy and dye material (To): Fairchild is adding Epifine and Richtech as epoxy and dye material suppliers. All of the epoxy and dye materials are qualified to be used interchangeably. There is no difference in the form, fit, function or manufacturability of the devices when either the Hysol material or the alternate materials are used for assembly

(From): Affected products assembled and tested in SOT89 package at AUK in Korea (To): Jiangsu Changjiang Electronics Technology (JCET) in China is being qualified as an additional SOT89 package assembly/test site. Changes in package BOM are detailed in the following tables. Affected products will be fully compliant to the existing Fairchild Marketing outline drawing (MKT-MA03C) and all current published data sheet specifications. Product assembled at JCET will be interchangeable with current product. Quality and reliability will remain at the highest standards already demonstrated with Fairchild's existing products.