Motion-SPM™ in Mini-DIP
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The Motion-SPM™ in Mini-DIP series consists of a suite of seventeen IGBT inverter modules and two MOSFET modules offering excellent thermal resistance. Each module integrate three high voltage ICs (HVICs), one low voltage IC (LVIC) and six IGBTs with fast recovery diodes or MOSFETs in the compact Mini-DIP (44 mm X 26.8 mm) package. Designers can achieve increased design flexibility for the entire power range from 0.15kW to 3kW, as these devices range from 3A to 30 A in a single package outline. This Motion-SPM™ series could be reached to the targeted power rating of 30A in ultra-compact packaging through Fairchild’s Direct Bonded Copper (DBC) technology (FSBB series).
| Products | BVCES (Min) (V) | Ic (Tc=25oC) (A) |
Switching Frequency (kHz) | Motor Rating (kW) | Substrate | |
| IGBT Inverter | FSBS3CH60 | 600 | 3 | up to 20 | 0.3 | Ceramic |
| FSBS5CH60 | 600 | 5 | up to 20 | 0.45 | ||
| FSBS10CH60 | 600 | 10 | up to 20 | 1 | ||
| FSBS15CH60 | 600 | 15 | up to 20 | 1.5 | ||
| FSBB15CH60 | 600 | 15 | up to 20 | 1.5 | DBC | |
| FSBB20CH60 | 600 | 20 | up to 20 | 2.2 | ||
| FSBB30CH60 | 600 | 30 | up to 20 | 2.2 | ||
| FSBF3CH60B* | 600 | 3 | up to 20 | 0.3 | Full Molded | |
| FSBF5CH60B* | 600 | 5 | up to 20 | 0.5 | ||
| FSBF10CH60BT* | 600 | 10 | up to 20 | 0.8 | ||
| FSBF10CH60B* | 600 | 10 | up to 20 | 1.0 | ||
| FSBF15CH60BT* | 600 | 15 | up to 20 | 1.1 | ||
| FSBB15CH60BT* | 600 | 15 | up to 20 | 1.5 | DBC | |
| FSBB15CH60B* | 600 | 15 | up to 20 | 1.7 | ||
| FSBB20CH60BT* | 600 | 20 | up to 20 | 2.2 | ||
| FSBB20CH60B* | 600 | 20 | up to 20 | 2.4 | ||
| FSBB30CH60B* | 600 | 30 | up to 20 | 3.0 | ||
| MOSFET Inverter | FCBS0550 | 500 | 5 | up to 20 | 0.15 | Ceramic |
| FCBS0650 | 500 | 6 | up to 20 | 0.2 |
*three bootstrap diodes integrated
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3A to 30A rating in one package (with identical mechanical layouts)
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