| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
J5555
| |
| Family Code | 0S3 | |
| Package Type | TO-252(DPAK) | |
| Package Description | 002, MOLDED PACKAGE, TO-252 2 LDS. SMD | |
| Pin Count | 2 | |
| FIT | 11.5 | |
| MSL Rating | | | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 63 | °C/Watt |
| Thermal Impedance (Theta JC) | 2 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
|
|
| UL Flammability Rating | DPG | |
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
