| General Information |
| Device Marking(TOP MARK) | PX
| |
| Family Code | 0N4 | |
| Package Type | MicroPak | |
| Package Description | 6LD, MICROPAK MLP, 1.0MM X 1.45MM (PREMOLDED) | |
| Pin Count | 6 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Base Metal/Leadframe Material | Cu with NiPdAu | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication |
| Fabrication Process Identifier | PM6FS50BC5S | |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5um - 1.5um Au | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 9000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| Package Assembly* |
| Wire Material | Au | |
| Wire Diameter | 0.8 MIL | |
| DAP Size | 6L | |
| Frame Material | 1.45X1.0MM | |
